Copper/Molybdenum/Copper is a composite material with a "sandwich" structure, consisting of a central core of molybdenum metal clad on both sides with pure copper. It is abbreviated as CMC (Cu/Mo/Cu). The performance of CMC can be tuned by adjusting the thickness ratio of copper and molybdenum layers. It features high thermal conductivity, high strength, and a low thermal expansion coefficient, making it suitable for use as heat sinks and thermal bases for RF packages, multilayer ceramic circuits, and power devices.
Large Sheet Sizes Available: Maximum dimensions of 400 mm (length) × 200 mm (width).
Cost-Effective: Can be stamped into parts, reducing overall manufacturing costs.
High Interface Bonding Strength: Excellent resistance to thermal shock cycles.
Adjustable Thermal Expansion Coefficient: Designed to match the requirements of different materials such as semiconductors and ceramics.
High Thermal Conductivity: Ensures efficient heat dissipation.
Non-Magnetic: Suitable for applications requiring non-magnetic properties.
| Material | Grade | Composition | Average In-Plane CTE [ppm/K] (Room Temperature ~ 400°C) | Through-Thickness Thermal Conductivity [W/(m·K)] | Density [g/cm³] |
|---|---|---|---|---|---|
| CMC | CMC111 | Cu/Mo/Cu | 8.8 ± 0.5 | >200 | 9.4 ± 0.2 |
| CMC | CMC121 | Cu/Mo/Cu | 7.8 ± 0.5 | >190 | 9.6 ± 0.2 |
| CMC | CMC131 | Cu/Mo/Cu | 6.8 ± 0.5 | >180 | 9.7 ± 0.2 |
| CMC | CMC141 | Cu/Mo/Cu | 6.0 ± 0.5 | >170 | 9.8 ± 0.2 |
| CMC | CMC-74 | Cu/Mo/Cu | 5.6 ± 0.5 | >160 | 9.9 ± 0.2 |
Notes:
CMC111 represents Cu/Mo/Cu with a thickness ratio of 1:1:1.
CMC-74 represents Cu/Mo/Cu with a thickness ratio of 13:74:13.
Primarily used as heat sinks, lead frames, and thermal expansion and heat conduction channels for multilayer printed circuit boards (PCBs).