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Copper Tungsten Alloys

Tungsten Copper Plate

What Is Tungsten Copper Plate?

Tungsten copper plate is a composite material made by combining tungsten and copper through a specific process. This material combines the high melting point, hardness, density, and wear resistance of tungsten with the excellent electrical and thermal conductivity of copper. Tungsten copper plates are commonly used in electrical discharge machining (EDM) electrodes, high-voltage electrical contacts, conductive and heat dissipation components, and other applications requiring high temperature resistance, electrical conductivity, and thermal conductivity. The ratio of tungsten to copper can be adjusted according to usage requirements to achieve different physical and mechanical properties.

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Tungsten Copper Plate Dimensions

Thickness:2-50mm

Width:<390mm

Length:<500mm

Our company also customizes the dimensions of tungsten copper plates according to customer requirements. 


Standard Stock

ThicknessWidthLength
 2-50mm 100mm 100mm
 100mm 200mm
 200mm 300mm
 300mm 400mm



Tungsten Copper Material Properties

GradeCu%(WT)W%(WT)RWMADensity g/cm3ConductivityHardnessThermal ConductivityThermal expansion coefficient
Class(Min)(Min)(Min)
CuW5545±2Balance1012.30g/cm349%IACS125HB~260(W/mK)~11.7(10-6/K)
CuW6040±2Balance
12.75g/cm347%IACS140HB

CuW6535±2Balance
13.30g/cm344%IACS155HB

CuW7030±2Balance
13.80g/cm342%IACS175HB~240(W/mK)~9.7(10-6/K)
CuW7525±2Balance1114.50g/cm338%IACS195HB200~230   (W/mK)9.0~9.5   (10-6/K)
CuW8020±2Balance1215.15g/cm334%IACS220HB190~210(W/mK)8.0~8.5   (10-6/K)
CuW8515±2Balance
15.90g/cm330%IACS240HB180~200(W/mK)7.0~7.5(10-6/K)
CuW9010±2Balance
16.80g/cm328%IACS260HB160~180(W/mK)6.3~6.8(10-6/K)



Manufacturing Processes

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Application

●Arc contacts and vacuum contacts for high and medium voltage switches or circuit breakers

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●Electrodes for electrical discharge machining (EDM)

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●High-temperature resistant materials

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●Heat dissipation devices used in electronic equipment

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●Electrodes for resistance welding

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●Electronic packaging and heat sink materials

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●Electrodes and nozzles are used in plasma spraying equipment

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